團簇式多腔體真空系統(tǒng)(星型)用于多層膜結(jié)構(gòu)的沉積和生長，可以消除交叉污染，有利于高品質(zhì)電學(xué)器件的制備。

Cluster tools eliminate cross-contamination in multi-layer thin film structures and allow the production of high-quality electronic devices. Each module as described below is controlled independently allowing simultaneous deposition in all chambers.

真空水平 Vacuum:Ultra-high vacuum (UHV).

基底尺寸 Substrate size:10cmx10cm or 15.6cmx15.6cm.

功能模塊 Modules:

• PECVD: RF， VHF and pulsed (modulated) RF plasma.

• HWCVD.

• Sputtering (ITO， AZO， metals， etc) with oscillation.

• Laser crystallization.

• Rapid thermal annealing.

• Park station with heating capability

• Isolation and Transfer Zone (ITZ) with robotic arm (8 or 10 port locations)

• Load lock with the following options:

• single substrate capability.

• connection to glove box.

• multi-substrate capability.

• In-situ characterization module

系統(tǒng)控制 Control:Computer controlled with easy to use HMI and optional data logging.

系統(tǒng)保證 Systems guarantees are defined in the contract and include*:

• Base pressure on each chamber

• Temperature calibration

• Uniformity and opto-electronic properties for each material defined in the contract

• Functionality of all systems

* These are demonstrated during the Factory (or First) acceptance test (FAT) and Site (or Second) Acceptance Tests (SAT)