一、產(chǎn)品介紹Product introduction：

※本機型采用國際先進的特制光纖激光器，光束質(zhì)量好、體積小、光電轉(zhuǎn)換效率高。長期使用免維護、使用成本低、整機功耗小。

This model adopts international advanced special fiber laser, with good beam quality, small volume and high photoelectric conversion efficiency. Long term use, maintenance free, low cost and low power consumption of the whole machine

※采用進口磁懸浮式直線電機、0.5um高精密光柵尺和全閉環(huán)總線系統(tǒng)，具有加工速度快、精度高、維護率低等優(yōu)點。

The imported maglev linear motor, 0.5um high precision grating ruler and full closed loop bus system are adopted, which have the advantages of fast processing speed, high precision and low maintenance rate.

※ 主要用于氧化鋁、氧化鋯、氮化鋁、氮化硅等先進陶瓷的激光切割和打孔。

It is mainly used for laser cutting and drilling of advanced ceramics such as alumina, zirconia, aluminum nitride and silicon nitride.

※配合CCD視覺定位系統(tǒng)還可以用于金屬化陶瓷、芯片基板的切割劃線等。

With CCD visual positioning system, it can also be used for cutting and marking of metallized ceramics and chip substrate

※也可用于各種精密的醫(yī)療器械、**產(chǎn)品、航空航天等產(chǎn)品的精細微孔加工，*小孔徑可達0.02-0.03mm。

It can also be used for fine micropore processing of various precision medical devices, military products, aerospace and other products, with a minimum pore diameter of 0.02-0.03mm

二、產(chǎn)品應(yīng)用行業(yè)Product application industry：

※工業(yè)產(chǎn)品：各種工業(yè)陶瓷襯板和模具

Industrial products: all kinds of industrial ceramic lining plates and molds。

※PCB行業(yè)： 陶瓷電路板的切割打孔劃線。

PCB industry: cutting, punching and marking of ceramic circuit boards

※3C行業(yè)：陶瓷基板、手機陶瓷背板、中框，電子煙發(fā)熱片、陶瓷指紋識別蓋板等.

3C industry: ceramic substrate, mobile phone ceramic back plate, middle frame, electronic smoke heating plate, ceramic fingerprint identification cover plate, etc

三、技術(shù)參數(shù)technical parameter：